"They're basically like a man-made forest," says Spencer.
以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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"In Venezuela, you're dealing with equipment that's been degraded by many years of neglect," says Jackson. "Ten to 15 years ago, Venezuela was producing 1.5 million barrels a day more than it does today."
从品类来看，分化趋势明显。魔镜洞察数据显示，AI教辅益智类产品增长474%，而以毛绒类产品为代表的AI潮玩，增速更是达到799.7%。